سه نظام الکترواستاتیک – کامسول

This models pressure-dependent heating of 4 inch wafer on unipolar electrostatic chuck. Wafer sits on top of ring with electrostatic force holdong down wafer to counter upward pressure from gas flowing in gap between wafer and chuck surface. It is a problem involving 4 coupled physics (SM, ES, LF + HT) and moving mesh.
involves electrostatic force, fluid-structure interaction and heat transfer. for now it is 2d Axisymmetric but can be adapted to a 3D model with more detailed gas channel patterns on e-chuck surface.