تشکیل دندریت کنترل شده با انتشار با استفاده از روش مجموعه سطح – کامسول

The present model demonstrates diffusion-controlled electrodeposition of copper on microstructured band electrode arrays (MEA). Mass transport by Fickian diffusion of copper ions is solved using the Transport of Diluted Species interface. Dendrite formation as a consequence of diffusion-controlled electrodeposition is captured using the Level Set interface. The electrodeposition velocity is prescribed in terms of diffusive flux in the model. The dendrite formation is found to be more predominant for the peripheral electrode in MEA when compared to the inner electrodes in MEA.